3nm technology, mass production in the first half of next year, news reports that Intel's next generation chips will be manufactured by TSMC

Currently, TSMC and Intel have not commented.

According to the previously disclosed technical details, TSMC will be responsible for producing three key Lunar Lake chips for Intel, including CPUs, GPUs, and NPUs, all using the 3nm process.

In addition, there are reports that TSMC will be responsible for producing high-speed I/O (PCH) chips using the 5 nm process and will begin mass production in the first half of next year.

Intel has broken the tradition of producing mainstream platform CPUs internally, and its decision to outsource its business to TSMC implies potential cooperation in the future.

IT Home Note: Unlike the previous two generations of Intel laptop platforms, Lunar Lake integrates CPUs, GPUs, and NPUs into System on Chip (SoC).

Then, Intel's Foveros advanced technology is utilized in packaging, combined with SoC and high-speed I/O chips, and DRAM LPDDR5x and two advanced packaging chips are packaged on the same IC substrate.