NVIDIA Blackwell GPU exposure: B100 will be equipped with 192GB HBM3e video memory, and B200 will be equipped with 288GB video memory

According to XpeaGPU, the upcoming B100 GPU will use two chips based on TSMC's CoWoS-L packaging technology, using advanced 2.5D packaging technology. This technology can stack chips together to increase processing power while saving space and reducing power consumption. Consumption.

XpeaGPU revealed that the two computing chips of the B100 GPU will be connected to eight 8-Hi HBM3e memory stacks, with a total capacity of 192GB. It is worth mentioning that AMD has equipped 8 HBM3 chips on its Instinct MI300 GPU, providing the same capacity of 192GB of video memory.

Looking to the future, according to the tipster, the next generation Blackwell GPU, codenamed B200, will use 12-Hi technology to achieve higher capacity, and the video memory will reach 288GB, but it has not yet been revealed whether it is HBM3e or HBM4.

NVIDIA has previously warmed up the super performance of the B100 GPU and confirmed that it will be launched in 2024.