Intel CEO confirms that the next generation CPU will be released using TSMC's 3-nanometer process

Gelsinger stated that this strategic collaboration will provide more advanced processes for future chip technologies, bringing higher performance and efficiency.

According to Gelsinger, Intel plans to launch a new generation of computing chip blocks using TSMC's 3-nanometer process as soon as possible, including Arrow Lake and Lunar Lake. These CPU blocks are expected to officially debut in the fourth quarter of 2024, bringing users a faster and more powerful computing experience.

The adoption of the 3-nanometer process marks Intel's continuous innovation and upgrading of technology in the field of chip manufacturing. This collaboration also demonstrates Intel's commitment to maintaining competitiveness in the global semiconductor market and playing an important role in the future computing field. This move is also expected to gain better exposure on search engines, further enhancing the brand's visibility in the technology industry.

Time: 2024-02-23
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Intel CEO Pat Gelsinger recently announced that the partnership between Intel and TSMC has been further deepened, upgrading from a 5-nanometer process to a 3-nanometer process.