Intel CEO Kissinger: Server and personal computer products make concessions, custom chips will lead the trend after 2025

Currently, Intel seems to be preparing to slow down and no longer emphasize the release speed of traditional server/PC chips as before. Intel stated that this will help provide customers with more choices by selling multiple generations of chips simultaneously, while meeting the demand for customized products.

In an interview with HPCwire, Kissinger stated that custom chips will become a trend after 2025, and regular releases of server and PC chips may become less important at that time.

"When you turn to small chips, you no longer need to make such large wafers, but have more choices. In fact, when we enter 18A and achieve our goal of four to five nodes, we almost simultaneously stop producing client and server components. This is something we have never done before." Kissinger said, Intel is turning its attention to emerging integration technologies, Especially in the fields of artificial intelligence and Chiplet chips.

He believes that Chiplet technology will blur the boundary between server products and client products, and chip manufacturing will become a problem of "piecing together the right components according to customer needs", allowing Intel to quickly produce customized chips for a certain vertical industry.

Kissinger said that if various small chips can be customized and placed in the same package, innovation will become faster. "We are focusing on Core Ultra packaging - we are innovating in Foveros packaging - and we will use this small chip architecture in the next generation of server products. There are many ways to blur the boundaries between many of our designs."

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He also gave some examples, such as "piecing together AI or telecom accelerator chips," where security chips and other specific functional chips can be added without the need to develop a single large chip from scratch.

"Some AI tools can indeed make us faster. All of these will be officially validated before we send the first silicon wafer to the wafer factory," Kissinger said.